- Производитель :
- 3M
- категория продукта :
- Панели для микросхем, транзисторов
- Contact Finish - Mating :
- Gold
- Contact Finish - Post :
- Gold
- Contact Finish Thickness - Mating :
- 30.0µin (0.76µm)
- Contact Finish Thickness - Post :
- 30.0µin (0.76µm)
- Contact Material - Mating :
- Beryllium Copper
- Contact Material - Post :
- Beryllium Copper
- Features :
- Closed Frame
- Housing Material :
- Polysulfone (PSU), Glass Filled
- Mounting Type :
- Connector
- Number of Positions or Pins (Grid) :
- 64 (2 x 32)
- Operating Temperature :
- -55°C ~ 125°C
- Pitch - Mating :
- 0.070" (1.78mm)
- Pitch - Post :
- 0.070" (1.78mm)
- Product Status :
- Active
- Termination :
- Press-Fit
- Type :
- DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing
- Спецификации
- 264-1300-00-0602J
