200-6310-9UN-1900

Производитель :

3M

категория продукта :

Панели для микросхем, транзисторов

Contact Finish - Mating :

Gold

Contact Finish - Post :

Gold

Contact Finish Thickness - Mating :

30.0µin (0.76µm)

Contact Finish Thickness - Post :

30.0µin (0.76µm)

Contact Material - Mating :

Beryllium Copper

Contact Material - Post :

Beryllium Copper

Features :

-

Housing Material :

Polyethersulfone (PES)

Mounting Type :

Through Hole

Number of Positions or Pins (Grid) :

100 (10 x 10)

Operating Temperature :

-55°C ~ 150°C

Pitch - Mating :

0.100" (2.54mm)

Pitch - Post :

0.100" (2.54mm)

Product Status :

Last Time Buy

Termination :

Solder

Type :

PGA, ZIF (ZIP)