- Производитель :
- 3M
- категория продукта :
- Панели для микросхем, транзисторов
- Contact Finish - Mating :
- Gold
- Contact Finish - Post :
- Gold
- Contact Finish Thickness - Mating :
- -
- Contact Finish Thickness - Post :
- 30.0µin (0.76µm)
- Contact Material - Mating :
- Beryllium Copper
- Contact Material - Post :
- Beryllium Copper
- Features :
- -
- Housing Material :
- Polysulfone (PSU), Glass Filled
- Mounting Type :
- Through Hole
- Number of Positions or Pins (Grid) :
- 24 (1 x 24)
- Operating Temperature :
- -55°C ~ 125°C
- Pitch - Mating :
- 0.100" (2.54mm)
- Pitch - Post :
- 0.100" (2.54mm)
- Product Status :
- Active
- Termination :
- Solder
- Type :
- SIP, ZIF (ZIP)
- Спецификации
- 224-5809-00-0602
