- Производитель :
- 3M
- категория продукта :
- Панели для микросхем, транзисторов
- Contact Finish - Mating :
- Gold
- Contact Finish - Post :
- Gold
- Contact Finish Thickness - Mating :
- -
- Contact Finish Thickness - Post :
- -
- Contact Material - Mating :
- Beryllium Copper
- Contact Material - Post :
- Beryllium Copper
- Features :
- Open Frame
- Housing Material :
- Polyethersulfone (PES)
- Mounting Type :
- Through Hole
- Number of Positions or Pins (Grid) :
- 60 (4 x 15)
- Operating Temperature :
- -
- Pitch - Mating :
- 0.020" (0.50mm)
- Pitch - Post :
- 0.020" (0.50mm)
- Product Status :
- Active
- Termination :
- Solder
- Type :
- QFN
- Спецификации
- 260-5204-01
