- Производитель :
- 3M
- категория продукта :
- Панели для микросхем, транзисторов
- Contact Finish - Mating :
- Gold
- Contact Finish - Post :
- Gold
- Contact Finish Thickness - Mating :
- 250.0µin (6.35µm)
- Contact Finish Thickness - Post :
- 250.0µin (6.35µm)
- Contact Material - Mating :
- Beryllium Copper
- Contact Material - Post :
- Beryllium Copper
- Features :
- Closed Frame
- Housing Material :
- Polyether Imide (PEI), Glass Filled
- Mounting Type :
- Through Hole
- Number of Positions or Pins (Grid) :
- 32 (2 x 16)
- Operating Temperature :
- -55°C ~ 105°C
- Pitch - Mating :
- 0.100" (2.54mm)
- Pitch - Post :
- 0.100" (2.54mm)
- Product Status :
- Obsolete
- Termination :
- Solder
- Type :
- DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
- Спецификации
- 232-1297-00-3303
